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Memory Integrated Circuits MT29F4G08ABBDAH4-IT:D BGA-63 NAND Flash Product Description: Micron NAND Flash devices include an asynchronous data interface for high-performance I/O operations. These ...
Memory Integrated Circuits MT29F4G08ABBDAH4-IT:D BGA-63 NAND Flash Product Description: Micron NAND Flash devices include an asynchronous data interface for high-performance I/O operations. These ... more
Brand Name:Micron Technology
Model Number:MT29F4G08ABBDAH4-IT:D
Place of Origin:USA
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S34ML04G300BHI000 Memory IC Chip 4Gbit SLC NAND Flash Memory IC BGA-63 Product Description Of S34ML04G300BHI000 S34ML04G300BHI000 is SLC NAND Flash Memory, it is offered with a 3.3-V VCC power supply, and a x8 I/O interface. Its NAND cell provides the ...
S34ML04G300BHI000 Memory IC Chip 4Gbit SLC NAND Flash Memory IC BGA-63 Product Description Of S34ML04G300BHI000 S34ML04G300BHI000 is SLC NAND Flash Memory, it is offered with a 3.3-V VCC power supply, and a x8 I/O interface. Its NAND cell provides the ... more
Brand Name:Original Factory
Model Number:S34ML04G300BHI000
Place of Origin:CN
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...-Supply 1.7V ~ 1.95V OperatingTemperature 0°C ~ 70°C (TA) MountingType Surface Mount Package/Case 63-VFBGA Global inventory Warehouses in Asia have a large number of stocks all year round, with more than 28,000 varieties. It has 2 warehouses, one in
...-Supply 1.7V ~ 1.95V OperatingTemperature 0°C ~ 70°C (TA) MountingType Surface Mount Package/Case 63-VFBGA Global inventory Warehouses in Asia have a large number of stocks all year round, with more than 28,000 varieties. It has 2 warehouses, one in more
Brand Name:Micron Technology Inc.
Model Number:MT29F4G08ABBDAH4:D
Minimum Order Quantity:1PCS
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WDS-750 Professional PCB Motherboard Mobile Phone Laptop Computer Electrical Maintenance Repair Tool Kit Details Picture optical alignment iphone laptop computer remove machine: Touch screen with human interface,heating time,heating temperature,reflow ...
WDS-750 Professional PCB Motherboard Mobile Phone Laptop Computer Electrical Maintenance Repair Tool Kit Details Picture optical alignment iphone laptop computer remove machine: Touch screen with human interface,heating time,heating temperature,reflow ... more
Brand Name:Wisdomshow optical alignment bga rework station
Place of Origin:Guangdong, China
Certification:ce
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S25FL128SAGBHIA10 Infineon 128Mb 3V 133MHz Serial NOR Flash BGA-24 Manufacturer: Infineon Product Type: NOR Flash Installation style: SMD/SMT Package / Box: BGA-24 Series: S25FL128S Storage capacity: 128 Mbit Supply Voltage - Min: 2.7 V Supply Voltage - ...
S25FL128SAGBHIA10 Infineon 128Mb 3V 133MHz Serial NOR Flash BGA-24 Manufacturer: Infineon Product Type: NOR Flash Installation style: SMD/SMT Package / Box: BGA-24 Series: S25FL128S Storage capacity: 128 Mbit Supply Voltage - Min: 2.7 V Supply Voltage - ... more
Brand Name:Infineon
Model Number:S25FL128SAGBHIA10
Place of Origin:Germany
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High Precision K-sensor Control Mobile Phone BGA Rework Station Specification Mobile Phone BGA Rework Station Model:HS-700 Power Supply AC 100V / 220V±10% 50/60Hz Total power 2600W Heater power Top heater 1200W(Max), bottom heater 1200W(Max) Electric ...
High Precision K-sensor Control Mobile Phone BGA Rework Station Specification Mobile Phone BGA Rework Station Model:HS-700 Power Supply AC 100V / 220V±10% 50/60Hz Total power 2600W Heater power Top heater 1200W(Max), bottom heater 1200W(Max) Electric ... more
Brand Name:HSTECH
Model Number:HS-700
Place of Origin:China
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5CGTFD7D5F27I7N Programmable IC Chip Field Programmable Gate Array (FPGA) IC 336 7880704 149500 Package 672-BGA Number of LABs/CLBs 56480 Number of Logic Elements/Cells 149500 Total RAM Bits 7880704 Number of I/O 336 Voltage - Supply 1.07V ~ 1.13V Mounting...
5CGTFD7D5F27I7N Programmable IC Chip Field Programmable Gate Array (FPGA) IC 336 7880704 149500 Package 672-BGA Number of LABs/CLBs 56480 Number of Logic Elements/Cells 149500 Total RAM Bits 7880704 Number of I/O 336 Voltage - Supply 1.07V ~ 1.13V Mounting... more
Brand Name:INTEL/ALTERA
Model Number:5CGTFD7D5F27I7N
Place of Origin:original
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FR4 HASL QFN BGA DIP Impedance Control Pcb SMT Assembly PCB SMT Assembly Introduction Our Service: Full Turnkey PCB Assembly; PCB Assembly Services; Lead-free Assembly; PCB Assembly Quote; Prototype PCB Assembly; BGA Assembly; Components Sourcing Service; ...
FR4 HASL QFN BGA DIP Impedance Control Pcb SMT Assembly PCB SMT Assembly Introduction Our Service: Full Turnkey PCB Assembly; PCB Assembly Services; Lead-free Assembly; PCB Assembly Quote; Prototype PCB Assembly; BGA Assembly; Components Sourcing Service; ... more
Brand Name:HNL-PCBA
Model Number:PCB Assembly 04
Place of Origin:CHINA
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Product Description BGA rework station goldland GL-A5 large-scale optical alignment BGA rework station Related Product we also deals with below Universal AI machine spare parts : Description Part Number Universal AI spare parts SSSCP 6-32 X 1/2 80004705 ...
Product Description BGA rework station goldland GL-A5 large-scale optical alignment BGA rework station Related Product we also deals with below Universal AI machine spare parts : Description Part Number Universal AI spare parts SSSCP 6-32 X 1/2 80004705 ... more
Brand Name:Goldland
Model Number:GL-A5 GL-A7
Place of Origin:China
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IMBF170R450M1XTMA1 Integrated Chips Best Selling Integrated Circuits Ic BGA Product Description Fully controllable dV/dt, optimized for EMI Compatible with flyback controllers with 12 V / 0 V gate source voltage SMD (surface mount) package with increased ...
IMBF170R450M1XTMA1 Integrated Chips Best Selling Integrated Circuits Ic BGA Product Description Fully controllable dV/dt, optimized for EMI Compatible with flyback controllers with 12 V / 0 V gate source voltage SMD (surface mount) package with increased ... more
Brand Name:Original Factory
Model Number:IMBF170R450M1XTMA1
Place of Origin:China
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original new BOM Microcontroller MCU IC BGA-292 SAK-TC387QP-160 F300S SAK-TC387QP-160F300S AD AE A microcontroller (MCU) IC (Integrated Circuit) is a type of electronic component that incorporates a central processing unit (CPU), memory, and various input/...
original new BOM Microcontroller MCU IC BGA-292 SAK-TC387QP-160 F300S SAK-TC387QP-160F300S AD AE A microcontroller (MCU) IC (Integrated Circuit) is a type of electronic component that incorporates a central processing unit (CPU), memory, and various input/... more
Brand Name:INFINEON
Model Number:SAK-TC387QP-160F300S AE
Place of Origin:Original Brand
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3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich ...
3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich ... more
Brand Name:Ziitek
Model Number:TIF030-05
Place of Origin:China
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BGA Test Probe Double Head Spring Loaded Pogo Pin Material: These pins are typically made from brass or stainless steel. The material you select will depend on the application you are using the pin for. For example, if you are using the Pogo Pin for ...
BGA Test Probe Double Head Spring Loaded Pogo Pin Material: These pins are typically made from brass or stainless steel. The material you select will depend on the application you are using the pin for. For example, if you are using the Pogo Pin for ... more
Brand Name:TX
Place of Origin:China
Certification:ICAS ROHS ULS GS REACH
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BGA 9*7.5 Black MPPO JEDEC Tray for Electronic Products JEDEC tray is a standard matrix tray, most of which have very similar dimensions 12.7 inches by 5.35 inches (322.6 mm x 135.89 mm). It is used throughout the semiconductor and microelectronics ...
BGA 9*7.5 Black MPPO JEDEC Tray for Electronic Products JEDEC tray is a standard matrix tray, most of which have very similar dimensions 12.7 inches by 5.35 inches (322.6 mm x 135.89 mm). It is used throughout the semiconductor and microelectronics ... more
Brand Name:Hiner-pack
Model Number:HN22035
Place of Origin:Shenzhen China
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In Stock Original IC XC7A200T-2FBG676I BGA Integrated Circuit To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided. We attach great importance to establishing and ...
In Stock Original IC XC7A200T-2FBG676I BGA Integrated Circuit To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided. We attach great importance to establishing and ... more
Brand Name:XILINX
Model Number:XC7A200T-2FBG676I
Place of Origin:original
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BGA Hdi Printed Circuit Boards Immersion Gold 1.6mm 6 Layer FR4 HDI PCB Board HDI Circuit Board HDI Printed Circuit Boards HDI PCB Design PCB Board Manufacturing 6L 2+N+2 HDI Printed Circuit Boards HDI stands for High-Density Interconnector. It is a ...
BGA Hdi Printed Circuit Boards Immersion Gold 1.6mm 6 Layer FR4 HDI PCB Board HDI Circuit Board HDI Printed Circuit Boards HDI PCB Design PCB Board Manufacturing 6L 2+N+2 HDI Printed Circuit Boards HDI stands for High-Density Interconnector. It is a ... more
Brand Name:Huashengxin
Model Number:135416
Place of Origin:China
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CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360 New Imported Original Spot Product Attribute Attribute Value Select Attribute Manufacturer: Qualcomm RF360 Product Category: Qualcomm Brand: RF360 Company Service 1. We keep more than 10 ...
CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360 New Imported Original Spot Product Attribute Attribute Value Select Attribute Manufacturer: Qualcomm RF360 Product Category: Qualcomm Brand: RF360 Company Service 1. We keep more than 10 ... more
Brand Name:Qualcomm
Model Number:CSR8645B04-IBBC-R
Place of Origin:USA
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XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as a computer or electronic device. It typically includes a range of components, such as a central ...
XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as a computer or electronic device. It typically includes a range of components, such as a central ... more
Brand Name:XILINX
Model Number:XC6SLX16-2FTG256C
Place of Origin:TW
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TH58BVG2S3HBAI4 KIOXIA 4GB SLC BENAND 24NM BGA 9X11 Manufacturer:Kioxia Product Category:NAND Flash RoHS: Details Mounting Style:SMD/SMT Package / Case:TFBGA-63 Memory Size:4 Gbit Interface Type:Parallel Organization:512 M x 8 Timing Type:Synchronous Data ...
TH58BVG2S3HBAI4 KIOXIA 4GB SLC BENAND 24NM BGA 9X11 Manufacturer:Kioxia Product Category:NAND Flash RoHS: Details Mounting Style:SMD/SMT Package / Case:TFBGA-63 Memory Size:4 Gbit Interface Type:Parallel Organization:512 M x 8 Timing Type:Synchronous Data ... more
Brand Name:KIOXIA
Model Number:TC58CVG2S0HRAIG TC58CVG2S0HRAIJ TH58BVG2S3HBAI4 TH58NVG2S3HTA00 TC58NVG2S0HTA00 TC58NVG2S0HBAI4 TC58BVG2S0HTA00 TC58BVG2S0HBAI4
Place of Origin:TAIWAN
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Efficient Heat Dissipation Electronic PCBA as Laptop Motherboard ♦ What is Consumer Electronics PCBA? Consumer Electronics PCBA (Consumer Electronics Printed Circuit Board Assembly) is the core circuit board of consumer electronic products (such as mobile ...
Efficient Heat Dissipation Electronic PCBA as Laptop Motherboard ♦ What is Consumer Electronics PCBA? Consumer Electronics PCBA (Consumer Electronics Printed Circuit Board Assembly) is the core circuit board of consumer electronic products (such as mobile ... more
Minimum Order Quantity:1
Price:Inquiry Us
Payment Terms:T/T
