-
... with a system or sub-system in one single package. It is essential to next-generation package for fulfilling high performance and significant electrical characteristics by short interconnection paths.SiP is a substrate that enables to combine 2 or
... with a system or sub-system in one single package. It is essential to next-generation package for fulfilling high performance and significant electrical characteristics by short interconnection paths.SiP is a substrate that enables to combine 2 or more
Brand Name:Horexs
Place of Origin:china
Certification:UL
-
... process controls are used in every step of production to insure 'built-in' reliability and consistent quality. FEATURES: Small in size with high precision package It is suitably used in
... process controls are used in every step of production to insure 'built-in' reliability and consistent quality. FEATURES: Small in size with high precision package It is suitably used in more
Brand Name:JDC
Model Number:GRA
Place of Origin:CHINA
-
...Stack Flow Water Pressure Sensor Description 4-20ma air differential pressure transmitter stack flow This series of micro differential pressure transmitter adopts piezoresistive pressure sensor chip, and uses the film resistance on the substrate to carry out zero point correction, zero point temperature compensation and sensitivity compensation. The high-performance and stable silicon chip package...
...Stack Flow Water Pressure Sensor Description 4-20ma air differential pressure transmitter stack flow This series of micro differential pressure transmitter adopts piezoresistive pressure sensor chip, and uses the film resistance on the substrate to carry out zero point correction, zero point temperature compensation and sensitivity compensation. The high-performance and stable silicon chip package... more
Brand Name:Yunyi
Model Number:FM112
Place of Origin:China
-
...Package With Integrated Power Amplifier Product Description Of CC2652PSIPMOTR CC2652PSIPMOTR a System-in-Package (SiP) certified module, multiprotocol 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee®, BT® 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects(6LoWPAN), proprietary systems, including the 15.4-Stack...
...Package With Integrated Power Amplifier Product Description Of CC2652PSIPMOTR CC2652PSIPMOTR a System-in-Package (SiP) certified module, multiprotocol 2.4 GHz wireless microcontroller (MCU) supporting Thread, Zigbee®, BT® 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects(6LoWPAN), proprietary systems, including the 15.4-Stack... more
Brand Name:Original Factory
Model Number:CC2652PSIPMOTR
Place of Origin:CN
-
... IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch...
... IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch... more
Brand Name:Suneast
Model Number:WBD2200 PLUS
Place of Origin:Shenzhen, Guangdong Province, China
